Dear chapter leaders, Please fill in your part in the sections where you have gaps. If you are not available, your architects may want to do it on your behalf. * https://docs.google.com/document/d/1d2XE6Fp8uFC8bfEdpwy6jSF6kfU5pet3H4VilDeutgk more precisely, I want Cloud, WebUI, Apps, I2ND, IoT , Data and Security to provide your inputs in the tables: 1. D.1<y>.2.(1,2) FI-WARE GE Open Specifications (y = [2-8]) 2. SW/Inst&Admin/User&Prog 3. Technical Roadmap For the others (sustainability, ops, tools...) I'll do a quick check, maybe at the beginning. I intend to deliver as soon as I can, at least the "easy" ones (for instance roadmap does not look like a big hurdle and part of the open specs seem to be ready - not to mention a whole release of at least one chapter!) Note that I adopt this approach to alleviate the boring situation of one reporting and the others awaiting their turn. If this works well I may go for it in the future but if people do not cooperate I will go back to the usual dynamics. It is entirely up to the team. Regards, Miguel El 20/09/2016 a las 17:06, MIGUEL CARRILLO PACHECO escribió: > > Dear all, > > Unfortunately I have a doctor appointment tomorrow and I have to leave > at 11:15. > > My proposal is as follows: > > * As it does not make too much sense to spend so much time checking > the status one by one while the rest are waiting their turn, we > can prepare this part off-line. I'll create google doc and you'll > report the status there. > * It will be focused on M25 deliverables (or earlier ones that are > pending) > * We will start at 10:30 . 45 min should be more than enough. > * The dissemination and exploitation leaders are discharged (but > cordially invited if they really want to turn up!) > > The good news is that all R5 architectures are delivered and that we > have the first draft of the Open Specs of one chapter , let us see if > we can deliver it soon. > > Best regards, > > Miguel > > > -- > > Please update your address book with my new e-mail address:miguel.carrillopacheco at telefonica.com > > ---------------------------------------------------------------------- > _/ _/_/ Miguel Carrillo Pacheco > _/ _/ _/ _/ Telefónica Distrito Telefónica > _/ _/_/_/ _/ _/ Investigación y Edifico Oeste 1, Planta 6 > _/ _/ _/ _/ Desarrollo Ronda de la Comunicación S/N > _/ _/_/ 28050 Madrid (Spain) > Tel: (+34) 91 312 94 15 > > e-mail:miguel.carrillopacheco at telefonica.com > > Follow FIWARE on the net > > Website:http://www.fiware.org > Facebook:https://www.facebook.com/eu.fiware > Twitter:http://twitter.com/Fiware > LinkedIn:https://www.linkedin.com/groups/FIWARE-4239932 > ---------------------------------------------------------------------- -- Please update your address book with my new e-mail address: miguel.carrillopacheco at telefonica.com ---------------------------------------------------------------------- _/ _/_/ Miguel Carrillo Pacheco _/ _/ _/ _/ Telefónica Distrito Telefónica _/ _/_/_/ _/ _/ Investigación y Edifico Oeste 1, Planta 6 _/ _/ _/ _/ Desarrollo Ronda de la Comunicación S/N _/ _/_/ 28050 Madrid (Spain) Tel: (+34) 91 312 94 15 e-mail: miguel.carrillopacheco at telefonica.com Follow FIWARE on the net Website: http://www.fiware.org Facebook: https://www.facebook.com/eu.fiware Twitter: http://twitter.com/Fiware LinkedIn: https://www.linkedin.com/groups/FIWARE-4239932 ---------------------------------------------------------------------- -------------- next part -------------- An HTML attachment was scrubbed... URL: <https://lists.fiware.org/private/fiware-chapter-leaders/attachments/20160920/f6f6d40d/attachment.html>
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