[Fiware-chapter-leaders] FILL IN your inputs for tomorrow's meeting

MIGUEL CARRILLO PACHECO miguel.carrillopacheco at telefonica.com
Tue Sep 20 18:18:17 CEST 2016


Dear chapter leaders,

Please fill in your part in the sections where you have gaps. If you are 
not available, your architects may want to do it on your behalf.

  * https://docs.google.com/document/d/1d2XE6Fp8uFC8bfEdpwy6jSF6kfU5pet3H4VilDeutgk

more precisely, I want   Cloud, WebUI, Apps, I2ND, IoT , Data and 
Security to provide your inputs in the tables:

 1. D.1<y>.2.(1,2)    FI-WARE GE Open Specifications (y = [2-8])
 2. SW/Inst&Admin/User&Prog
 3. Technical Roadmap

For the others (sustainability, ops, tools...)  I'll do a quick check, 
maybe at the beginning.

I intend to deliver as soon as I can, at least the "easy" ones (for 
instance roadmap does not look like a big hurdle and part of the open 
specs seem to be ready - not to mention a whole release of at least one 
chapter!)

Note that I adopt this approach to alleviate the boring situation of one 
reporting and the others awaiting their turn. If this works well I may 
go for it in the future but if people do not cooperate I will go back to 
the usual dynamics. It is entirely up to the team.

Regards,

Miguel




El 20/09/2016 a las 17:06, MIGUEL CARRILLO PACHECO escribió:
>
> Dear all,
>
> Unfortunately I have a doctor appointment tomorrow and I have to leave 
> at 11:15.
>
> My proposal is as follows:
>
>   * As it does not make too much sense to spend so much time checking
>     the status one by one while the rest are waiting their turn, we
>     can prepare this part off-line. I'll create google doc and you'll
>     report the status there.
>   * It will be focused on M25 deliverables (or earlier ones that are
>     pending)
>   * We will start at 10:30 . 45 min should be more than enough.
>   * The dissemination and exploitation leaders are discharged (but
>     cordially invited if they really want to turn up!)
>
> The good news is that all R5 architectures are delivered and that we 
> have the first draft of the Open Specs of one chapter , let us see if 
> we can deliver it soon.
>
> Best regards,
>
> Miguel
>
>
> -- 
>
> Please update your address book with my new e-mail address:miguel.carrillopacheco at telefonica.com
>
> ----------------------------------------------------------------------
>       _/          _/_/                     Miguel Carrillo Pacheco
>      _/   _/     _/  _/   Telefónica       Distrito Telefónica
>     _/ _/_/_/   _/   _/   Investigación y  Edifico Oeste 1, Planta 6
>    _/   _/     _/  _/     Desarrollo       Ronda de la Comunicación S/N
>   _/          _/_/                         28050 Madrid (Spain)
>                                            Tel:  (+34) 91 312 94 15
>
>                           e-mail:miguel.carrillopacheco at telefonica.com
>
> Follow FIWARE on the net
>
> 	Website:http://www.fiware.org
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> 	Twitter:http://twitter.com/Fiware
> 	LinkedIn:https://www.linkedin.com/groups/FIWARE-4239932
> ----------------------------------------------------------------------

-- 

Please update your address book with my new e-mail address: miguel.carrillopacheco at telefonica.com

----------------------------------------------------------------------
      _/          _/_/                     Miguel Carrillo Pacheco
     _/   _/     _/  _/   Telefónica       Distrito Telefónica
    _/ _/_/_/   _/   _/   Investigación y  Edifico Oeste 1, Planta 6
   _/   _/     _/  _/     Desarrollo       Ronda de la Comunicación S/N
  _/          _/_/                         28050 Madrid (Spain)
                                           Tel:  (+34) 91 312 94 15

                          e-mail: miguel.carrillopacheco at telefonica.com

Follow FIWARE on the net

	Website:  http://www.fiware.org
	Facebook: https://www.facebook.com/eu.fiware
	Twitter:  http://twitter.com/Fiware
	LinkedIn: https://www.linkedin.com/groups/FIWARE-4239932
----------------------------------------------------------------------

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