Dear chapter leaders,
Please fill in your part in the sections where you have gaps. If you are
not available, your architects may want to do it on your behalf.
* https://docs.google.com/document/d/1d2XE6Fp8uFC8bfEdpwy6jSF6kfU5pet3H4VilDeutgk
more precisely, I want Cloud, WebUI, Apps, I2ND, IoT , Data and
Security to provide your inputs in the tables:
1. D.1<y>.2.(1,2) FI-WARE GE Open Specifications (y = [2-8])
2. SW/Inst&Admin/User&Prog
3. Technical Roadmap
For the others (sustainability, ops, tools...) I'll do a quick check,
maybe at the beginning.
I intend to deliver as soon as I can, at least the "easy" ones (for
instance roadmap does not look like a big hurdle and part of the open
specs seem to be ready - not to mention a whole release of at least one
chapter!)
Note that I adopt this approach to alleviate the boring situation of one
reporting and the others awaiting their turn. If this works well I may
go for it in the future but if people do not cooperate I will go back to
the usual dynamics. It is entirely up to the team.
Regards,
Miguel
El 20/09/2016 a las 17:06, MIGUEL CARRILLO PACHECO escribió:
>
> Dear all,
>
> Unfortunately I have a doctor appointment tomorrow and I have to leave
> at 11:15.
>
> My proposal is as follows:
>
> * As it does not make too much sense to spend so much time checking
> the status one by one while the rest are waiting their turn, we
> can prepare this part off-line. I'll create google doc and you'll
> report the status there.
> * It will be focused on M25 deliverables (or earlier ones that are
> pending)
> * We will start at 10:30 . 45 min should be more than enough.
> * The dissemination and exploitation leaders are discharged (but
> cordially invited if they really want to turn up!)
>
> The good news is that all R5 architectures are delivered and that we
> have the first draft of the Open Specs of one chapter , let us see if
> we can deliver it soon.
>
> Best regards,
>
> Miguel
>
>
> --
>
> Please update your address book with my new e-mail address:miguel.carrillopacheco at telefonica.com
>
> ----------------------------------------------------------------------
> _/ _/_/ Miguel Carrillo Pacheco
> _/ _/ _/ _/ Telefónica Distrito Telefónica
> _/ _/_/_/ _/ _/ Investigación y Edifico Oeste 1, Planta 6
> _/ _/ _/ _/ Desarrollo Ronda de la Comunicación S/N
> _/ _/_/ 28050 Madrid (Spain)
> Tel: (+34) 91 312 94 15
>
> e-mail:miguel.carrillopacheco at telefonica.com
>
> Follow FIWARE on the net
>
> Website:http://www.fiware.org
> Facebook:https://www.facebook.com/eu.fiware
> Twitter:http://twitter.com/Fiware
> LinkedIn:https://www.linkedin.com/groups/FIWARE-4239932
> ----------------------------------------------------------------------
--
Please update your address book with my new e-mail address: miguel.carrillopacheco at telefonica.com
----------------------------------------------------------------------
_/ _/_/ Miguel Carrillo Pacheco
_/ _/ _/ _/ Telefónica Distrito Telefónica
_/ _/_/_/ _/ _/ Investigación y Edifico Oeste 1, Planta 6
_/ _/ _/ _/ Desarrollo Ronda de la Comunicación S/N
_/ _/_/ 28050 Madrid (Spain)
Tel: (+34) 91 312 94 15
e-mail: miguel.carrillopacheco at telefonica.com
Follow FIWARE on the net
Website: http://www.fiware.org
Facebook: https://www.facebook.com/eu.fiware
Twitter: http://twitter.com/Fiware
LinkedIn: https://www.linkedin.com/groups/FIWARE-4239932
----------------------------------------------------------------------
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