[Fiware-wpa] Bringing info about packaging into the technical roadmap

[Juanjo Hierro]

Hi all,

  During our last WPLs/WPAs follow-up confcall, Pascal raised the issue about whether info about packaging should be reflected on the Technical Roadmap deliverable.

  It was agreed that I would send an email to the list elaborating on why I believe doing so would be wrong.   This is the email.

  The reasons why I believe it would be wrong to incorporate this info in the Technical Roadmap is the following:

  *   First and somehow practical: we have already submitted the Technical Roadmap deliverable accompanying Release 3 of FI-WARE, so it would be a bit contradictory that we come now with changes in the Technical Roadmap (to be reflected in the website I guess) that were not captured in the written deliverable.
  *   The technical roadmap is about planning of functional features in GEis.   It elaborates on how features/epics in the backlog are planned over time.   However, It doesn't need to reflect all the info about technical activities that are carried out (which are intended to be captured also in the backlog but as different entries, i.e., work items).
  *   It leads to management of complexity (structuring the Technical Roadmap so that info about packages and their planning is captured), with little value.

  Unless there are good reasons, we definitively would avoid capturing info about packaging in the Technical Roadmap.   If no issues are raised against the rationale above, we will assume that we will keep the Technical Roadmap without capturing info about packaging.

  Best regards,

-- Juanjo

-------------
Product Development and Innovation (PDI) - Telefonica Digital
website: www.tid.es<http://www.tid.es>
email: jhierro at tid.es<mailto:jhierro at tid.es>
twitter: twitter.com/JuanjoHierro

FI-WARE (European Future Internet Core Platform) Coordinator
and Chief Architect

FI-PPP Architecture Board chairman

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