Hi, This is the 3rd party innovation as it is now. I will add the TOC at the end. I quite frankly do not know what to do with it. As no one volunteered to do it, I am just putting all your contributions together (but by no means I am the "lead editor"). There are parts that are rather heterogeneous: leaving them will result in a rejection (different WPs look different) and removing the different ones would have the same result (it would look too similar to the previous one). I am not opening a debate via e-mail, just reporting on the status. Something for our weekly call on Monday. Best regards, Miguel -- ---------------------------------------------------------------------- _/ _/_/ Miguel Carrillo Pacheco _/ _/ _/ _/ Telefónica Distrito Telefónica _/ _/_/_/ _/ _/ Investigación y Edifico Oeste 1, Planta 9 _/ _/ _/ _/ Desarrollo Ronda de la Comunicación S/N _/ _/_/ 28050 Madrid (Spain) Tel: (+34) 91 483 26 77 e-mail: mcp at tid.es Follow FI-WARE on the net Website: http://www.fi-ware.org Facebook: http://www.facebook.com/pages/FI-WARE/251366491587242 Twitter: http://twitter.com/Fiware LinkedIn: http://www.linkedin.com/groups/FIWARE-4239932 ---------------------------------------------------------------------- ________________________________ Este mensaje se dirige exclusivamente a su destinatario. Puede consultar nuestra política de envío y recepción de correo electrónico en el enlace situado más abajo. This message is intended exclusively for its addressee. We only send and receive email on the basis of the terms set out at: http://www.tid.es/ES/PAGINAS/disclaimer.aspx -------------- next part -------------- A non-text attachment was scrubbed... Name: D.2.5.2 Third party innovation enablement in FI-WARE.docx Type: application/vnd.openxmlformats-officedocument.wordprocessingml.document Size: 310995 bytes Desc: not available URL: <https://lists.fiware.org/private/fiware-wpl/attachments/20140221/03e69630/attachment.docx>
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