[Fiware-data] No call, but backlog, roadmap and more

[SERGIO GARCIA GOMEZ]

Dear all,
I finally have delivered most of the required  inputs that we had from the WP, thanks you all for your contributions


·         R.3.2 delivery is ready for review. So far, only MDP sw release is pending, please do it ASAP and let me know.

·         The architecture document has been generated and delivered.

·         The roadmap has been updated. Boris, I’m still waiting for your confirmation… (check mail).

·         I produced 3rd party innovation enablement by myself.


So, there are only a  few recommendations and therefore I prefer to concentrate on them and skip the call:

·         Check Manuel’s request about the backlog and fulfil them if you haven’t done it yet

·         Be aware that the roadmap is being delivered this afternoon, if you want to make a last minute change, let me know.

I’ll ask to some of you individually different specific issues (catalogue, fi-lab, open specs for early finishing partners,… ) these days, please stay tuned.

Best Regards,

Sergio.




--
Sergio Garcia Gomez
Telefonica Digital (TI+D)
FI-WARE [http://www.fi-ware.eu<http://www.fi-ware.eu/>]
Parque Tecnologico de Boecillo.
47151 Boecillo (Valladolid), SPAIN.
E-mail: sergg at tid.es<mailto:sergg at tid.es>
Phone: (+34) 913129098 (IP)


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